dc.contributor.author | Tian, Yaolan | |
dc.contributor.author | Isotalo, Tero | |
dc.contributor.author | Konttinen, Mikko P. | |
dc.contributor.author | Li, Jiawei | |
dc.contributor.author | Heiskanen, Samuli | |
dc.contributor.author | Geng, Zhuoran | |
dc.contributor.author | Maasilta, Ilari | |
dc.date.accessioned | 2017-10-27T10:03:13Z | |
dc.date.available | 2018-01-05T22:45:08Z | |
dc.date.issued | 2017 | |
dc.identifier.citation | Tian, Y., Isotalo, T., Konttinen, M. P., Li, J., Heiskanen, S., Geng, Z., & Maasilta, I. (2017). Intregrating metallic wiring with three-dimensional polystyrene colloidal crystals using electron-beam lithography and three-dimensional laser lithography. <i>Journal of Physics D: Applied Physics</i>, <i>50</i>(5), Article 055302. <a href="https://doi.org/10.1088/1361-6463/aa5004" target="_blank">https://doi.org/10.1088/1361-6463/aa5004</a> | |
dc.identifier.other | CONVID_26531733 | |
dc.identifier.uri | https://jyx.jyu.fi/handle/123456789/55714 | |
dc.description.abstract | We demonstrate a method to fabricate narrow, down to a few micron
wide metallic leads on top of a three-dimensional colloidal crystal self-assembled from
polystyrene (PS) nanospheres of diameter 260 nm, using electron-beam lithography.
This fabrication is not straightforward due to the fact that PS nanospheres cannot
usually survive the harsh chemical treatments required in the development and lift-off
steps of electron-beam lithography. We solve this problem by increasing the chemical
resistance of the PS nanospheres using an additional electron-beam irradiation step,
which allows the spheres to retain their shape and their self-assembled structure, even
after baking to a temperature of 160 degrees C, the exposure to the resist developer and
the exposure to acetone, all of which are required for the electron-beam lithography
step. Moreover, we show that by depositing an aluminum oxide capping layer on top of
the colloidal crystal after the e-beam irradiation, the surface is smooth enough so that
continuous metal wiring can be deposited by the electron-beam lithography. Finally,
we also demonstrate a way to self-assemble PS colloidal crystals into a microscale
container, which was fabricated using direct-write three-dimensional laser-lithography.
Metallic wiring was also successfully integrated with the combination of a container
structure and a PS colloidal crystal. Our goal is to make a device for studies of thermal
transport in 3D phononic crystals, but other phononic or photonic crystal applications
could also be envisioned. Keywords: self-assembly, colloidal crystal, cross-linking,
electron-beam lithography, three-dimensional lithography, phononic crystal, photonic
crystal. | |
dc.language.iso | eng | |
dc.publisher | IOP Publishing | |
dc.relation.ispartofseries | Journal of Physics D: Applied Physics | |
dc.subject.other | colloidal crystal | |
dc.subject.other | cross-linking | |
dc.subject.other | electron-beam lithography | |
dc.subject.other | phononic crystal | |
dc.subject.other | photonic crystal | |
dc.subject.other | self-assembly | |
dc.subject.other | three-dimensional lithography | |
dc.title | Intregrating metallic wiring with three-dimensional polystyrene colloidal crystals using electron-beam lithography and three-dimensional laser lithography | |
dc.type | research article | |
dc.identifier.urn | URN:NBN:fi:jyu-201710244055 | |
dc.contributor.laitos | Fysiikan laitos | fi |
dc.contributor.laitos | Department of Physics | en |
dc.contributor.oppiaine | Nanoscience Center | fi |
dc.contributor.oppiaine | Nanoscience Center | en |
dc.type.uri | http://purl.org/eprint/type/JournalArticle | |
dc.date.updated | 2017-10-24T09:15:06Z | |
dc.type.coar | http://purl.org/coar/resource_type/c_2df8fbb1 | |
dc.description.reviewstatus | peerReviewed | |
dc.relation.issn | 0022-3727 | |
dc.relation.numberinseries | 5 | |
dc.relation.volume | 50 | |
dc.type.version | acceptedVersion | |
dc.rights.copyright | © 2017 IOP Publishing Ltd. This is a final draft version of an article whose final and definitive form has been published by IOP. Published in this repository with the kind permission of the publisher. | |
dc.rights.accesslevel | openAccess | fi |
dc.type.publication | article | |
dc.relation.doi | 10.1088/1361-6463/aa5004 | |
dc.type.okm | A1 | |