Intregrating metallic wiring with three-dimensional polystyrene colloidal crystals using electron-beam lithography and three-dimensional laser lithography
Tian, Y., Isotalo, T., Konttinen, M. P., Li, J., Heiskanen, S., Geng, Z., & Maasilta, I. (2017). Intregrating metallic wiring with three-dimensional polystyrene colloidal crystals using electron-beam lithography and three-dimensional laser lithography. Journal of Physics D: Applied Physics, 50(5), Article 055302. https://doi.org/10.1088/1361-6463/aa5004
Julkaistu sarjassa
Journal of Physics D: Applied PhysicsTekijät
Päivämäärä
2017Tekijänoikeudet
© 2017 IOP Publishing Ltd. This is a final draft version of an article whose final and definitive form has been published by IOP. Published in this repository with the kind permission of the publisher.
We demonstrate a method to fabricate narrow, down to a few micron
wide metallic leads on top of a three-dimensional colloidal crystal self-assembled from
polystyrene (PS) nanospheres of diameter 260 nm, using electron-beam lithography.
This fabrication is not straightforward due to the fact that PS nanospheres cannot
usually survive the harsh chemical treatments required in the development and lift-off
steps of electron-beam lithography. We solve this problem by increasing the chemical
resistance of the PS nanospheres using an additional electron-beam irradiation step,
which allows the spheres to retain their shape and their self-assembled structure, even
after baking to a temperature of 160 degrees C, the exposure to the resist developer and
the exposure to acetone, all of which are required for the electron-beam lithography
step. Moreover, we show that by depositing an aluminum oxide capping layer on top of
the colloidal crystal after the e-beam irradiation, the surface is smooth enough so that
continuous metal wiring can be deposited by the electron-beam lithography. Finally,
we also demonstrate a way to self-assemble PS colloidal crystals into a microscale
container, which was fabricated using direct-write three-dimensional laser-lithography.
Metallic wiring was also successfully integrated with the combination of a container
structure and a PS colloidal crystal. Our goal is to make a device for studies of thermal
transport in 3D phononic crystals, but other phononic or photonic crystal applications
could also be envisioned. Keywords: self-assembly, colloidal crystal, cross-linking,
electron-beam lithography, three-dimensional lithography, phononic crystal, photonic
crystal.
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IOP PublishingISSN Hae Julkaisufoorumista
0022-3727Asiasanat
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https://converis.jyu.fi/converis/portal/detail/Publication/26531733
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