VAL_AI: an integrated debugger tool for post-silicon validation
As demands for more complex SoCs becomes high due to several technological advancements, the market for these chips is endless and companies are driven to keep up with the changing times by streamlining their top-down process for a more efficient flow. Post-silicon validation is one of the most important steps during System-on-Chip production process as this happens after fabrication to test functionalities of chips in both nominal conditions and varied process, voltage, and temperature conditions. Post-silicon validation debugging is the last line of defense for all possible attacks and bugs. The process involves rigorous amount of iterative and repeated process of opening several files and comparing data from previous tests. Due to the complicated nature of debugging, there is a need to effectively systematize it and automate the current process of digital validation. Moreover, there are many software tools in the development stages and there is also a need to integrate them altogether. This work first starts with expounding on the current process and tools being used by NXP Semiconductors during post-silicon digital validation. The focus is then driven to automate merging files, visualization of data, and identification of possible causes of failure through a three-step solution: data collection, candidate identification, and problem analysis. The work begins with how the test runs are stored, queried, and shown. Two clustering techniques: kmeans and agglomerative clustering are also discussed. Some dimension reduction techniques like principal component analysis and uniform manifold and approximation projection were also elaborated. These techniques could help development and future work. Application integration is the last step to unify all infant software tools currently in the works under NXP Semiconductors.
...
Asiasanat
Metadata
Näytä kaikki kuvailutiedotKokoelmat
- Pro gradu -tutkielmat [29743]
Lisenssi
Samankaltainen aineisto
Näytetään aineistoja, joilla on samankaltainen nimeke tai asiasanat.
-
Particle radiation in microelectronics
Javanainen, Arto (University of Jyväskylä, 2012)The unavoidable presence of particle radiation in space and on the ground combined with constantly evolving technology necessitates a deep understanding of the basic mechanisms underlying radiation effects in materials ... -
Biomass-derived carbon–silicon composites (C@Si) as anodes for lithium-ion and sodium-ion batteries : A promising strategy towards long-term cycling stability : A mini review
Simoes dos Reis, Glaydson; Molaiyan, Palanivel; Subramaniyam, Chandrasekar M.; García-Alvarado, Flaviano; Paolella, Andrea; Pequeno de Oliveira, Helinando; Lassi, Ulla (Elsevier BV, 2023)The global need for high energy density and performing rechargeable batteries has led to the development of high-capacity silicon-based anode materials to meet the energy demands imposed to electrify plug-in vehicles to ... -
Single Event Burnout of SiC Junction Barrier Schottky Diode High-Voltage Power Devices
Witulski, A. F.; Arslanbekov, R.; Raman, A.; Schrimpf, R. D.; Sternberg, A.; Galloway, K. F.; Javanainen, Arto; Grider, D.; Lichtenwalner, D. J.; Hull, B. (Institute of Electrical and Electronics Engineers, 2018)Ion-induced degradation and catastrophic failures in high-voltage SiC Junction Barrier Schottky (JBS) power diodes are investigated. Experimental results agree with earlier data showing discrete jumps in leakage current ... -
Joint Spectral and Energy Efficiency Optimization for Downlink NOMA Networks
Khan, Wali Ullah; Jameel, Furqan; Ristaniemi, Tapani; Khan, Shafiullah; Sidhu, Guftaar Ahmad Sardar; Liu, Ju (Institute of Electrical and Electronics Engineers, 2020)Non-orthogonal multiple access (NOMA) holds the promise to be a key enabler of 5G communication. However, the existing design of NOMA systems must be optimized to achieve maximum rate while using minimum transmit power. ... -
A software for simulating dispersive properties of multilayered phononic crystal membranes
Lappalainen, Panu (2021)Tässä tutkielmassa kehitetty uudenlainen Kalvo-ohjelmisto simuloi monikerroksisten sylinterireikähilaisten fononikidekalvojen dispersioita äärelliselementtimenetelmää (FEM) käyttäen. Havainnollistavan systemaattisen ...
Ellei toisin mainittu, julkisesti saatavilla olevia JYX-metatietoja (poislukien tiivistelmät) saa vapaasti uudelleenkäyttää CC0-lisenssillä.