Ultrafast Laser Processing of 2D Materials : Novel Routes to Advanced Devices
Emelianov, A. V., Pettersson, M., & Bobrinetskiy, I. I. (2024). Ultrafast Laser Processing of 2D Materials : Novel Routes to Advanced Devices. Advanced Materials, Early online, Article 2402907. https://doi.org/10.1002/adma.202402907
Julkaistu sarjassa
Advanced MaterialsPäivämäärä
2024Tekijänoikeudet
© 2024 The Authors.
Ultrafast laser processing has emerged as a versatile technique for modifying materials and introducing novel functionalities. Over the past decade, this method has demonstrated remarkable advantages in the manipulation of 2D layered materials, including synthesis, structuring, functionalization, and local patterning. Unlike continuous-wave and long-pulsed optical methods, ultrafast lasers offer a solution for thermal heating issues. Nonlinear interactions between ultrafast laser pulses and the atomic lattice of 2D materials substantially influence their chemical and physical properties. This paper highlights the transformative role of ultrafast laser pulses in maskless green technology, enabling subtractive, and additive processes that unveil ways for advanced devices. Utilizing the synergetic effect between the energy states within the atomic layers and ultrafast laser irradiation, it is feasible to achieve unprecedented resolutions down to several nanometers. Recent advancements are discussed in functionalization, doping, atomic reconstruction, phase transformation, and 2D and 3D micro- and nanopatterning. A forward-looking perspective on a wide array of applications of 2D materials, along with device fabrication featuring novel physical and chemical properties through direct ultrafast laser writing, is also provided.
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Julkaisija
Wiley-VCHISSN Hae Julkaisufoorumista
0935-9648Asiasanat
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https://converis.jyu.fi/converis/portal/detail/Publication/213735168
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A.V.E. and M.P. acknowledged the Jane and Aatos Erkko Foundation for support. I.I.B. acknowledged the ANTARES project that has received funding from the European Union's Horizon 2020 research and innovation programm under Grant Agreement SGA-CSA No. 739570 under FPA No. 664387 (doi.org/10.3030/739570).Lisenssi
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