Thermalization of hot electrons via interfacial electron-magnon interaction
Chakraborty, S., & Heikkilä, T. T. (2019). Thermalization of hot electrons via interfacial electron-magnon interaction. Physical Review B, 100(3), Article 035423. https://doi.org/10.1103/PhysRevB.100.035423
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Physical Review BDate
2019Copyright
© 2019 American Physical Society
Recent work on layered structures of superconductors (S) or normal metals (N) in contact with ferromagnetic insulators (FI) has shown how the properties of the previous can be strongly affected by the magnetic proximity effect due to the static FI magnetization. Here we show that such structures can also exhibit a new electron thermalization mechanism due to the coupling of electrons with the dynamic magnetization, i.e., magnons in FI. We here study the heat flow between the two systems and find that in thin films the heat conductance due to the interfacial electron-magnon collisions can dominate over the well-known electron-phonon coupling below a certain characteristic temperature that can be straightforwardly reached with present-day experiments. We also study the role of the magnon band gap and the induced spin-splitting field induced in S on the resulting heat conductance and show that heat balance experiments can reveal information about such quantities in a way quite different from typical magnon spectroscopy experiments.
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American Physical SocietyISSN Search the Publication Forum
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https://converis.jyu.fi/converis/portal/detail/Publication/32142889
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Research Council of Finland; European CommissionFunding program(s)
Others, AoF; FET Future and Emerging Technologies, H2020; Academy Project, AoF
The content of the publication reflects only the author’s view. The funder is not responsible for any use that may be made of the information it contains.
Additional information about funding
This project was supported by the Academy of Finland via its Key Funding project (Project No. 305256) and regular Project Number 317118 and from the European Union’s Horizon 2020 research and innovation programme under Grant agreement No. 800923 (SUPERTEDLicense
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