Ahvenniemi, Esko; Akbashev, Andrew R.; Ali, Saima; Bechelany, Mikhael; Berdova, Maria; Boyadjiev, Stefan; Cameron, David C.; Chen, Rong; Chubarov, Mikhail; Cremers, Veronique; Devi, Anjana; Drozd, Viktor; Elnikova, Liliya; Gottardi, Gloria; Grigoras, Kestutis; Hausmann, Dennis M.; Hwang, Cheol Seong; Jen, Shih-Hui; Kallio, Tanja; Kanervo, Jaana; Khmelnitskiy, Ivan; Kim, Do Han; Klibanov, Lev; Koshtyal, Yury; Krause, A. Outi I.; Kuhs, Jakob; Kärkkänen, Irina; Kääriäinen, Marja-Leena; Kääriäinen, Tommi; Lamagna, Luca; Łapicki, Adam A.; Leskelä, Markku; Lipsanen, Harri; Lyytinen, Jussi; Malkov, Anatoly; Malygin, Anatoly; Mennad, Abdelkader; Militzer, Christian; Molarius, Jyrki; Norek, Małgorzata; Özgit-Akgün, Cagla; Panov, Mikhail; Pedersen, Henrik; Piallat, Fabien; Popov, Georgi; Puurunen, Riikka L.; Rampelberg, Geert; Ras, Robin H. A.; Rauwel, Erwan; Roozeboom, Fred; Sajavaara, Timo; Salami, Hossein; Savin, Hele; Schneider, Nathanaelle; Seidel, Thomas E.; Sundqvist, Jonas; Suyatin, Dmitry B.; Törndahl, Tobias; van Ommen, J. Ruud; Wiemer, Claudia; Ylivaara, Oili M. E.; Yurkevich, Oksana (AIP Publishing, 2017)
Atomic layer deposition (ALD), a gas-phase thin film deposition technique based on repeated,
self-terminating gas–solid reactions, has become the method of choice in semiconductor
manufacturing and many other technological ...