Superconducting tunnel junction fabrication on three-dimensional topography based on direct laser writing

Superconducting junctions are widely used in a multitude of applications ranging from quantum information science and sensing to solidstate cooling. Traditionally, such devices must be fabricated on flat substrates using standard lithographic techniques. In this study, we demonstrate a highly versatile method that allows for superconducting junctions to be fabricated on a more complex topography. It is based on maskless direct laser writing and two-photon lithography, which allows writing in 3D space. We show that high-quality normal metal–insulator–superconductor tunnel junctions can be fabricated on top of a 20-lm-tall three-dimensional topography. Combined with conformal resist coating methods, this technique could allow sub-micron device fabrication on almost any type of topography in the future.