Enhanced Charge Collection in SiC Power MOSFETs Demonstrated by Pulse-Laser Two-Photon Absorption SEE Experiments
Abstract
A two-photon absorption technique is used to
understand the mechanisms of single-event effects in silicon
carbide power MOSFETs and power junction barrier Schottky
diodes. The MOSFETs and diodes have similar structures
enabling identification of effects associated specifically with the
parasitic bipolar structure that is present in the MOSFETs, but
not the diodes. The collected charge in the diodes varies only
with laser depth, whereas it varies with depth and lateral
position in the MOSFETs. Optical simulations demonstrate that
the variations in collected charge observed are from the
semiconductor device structure, and not from metal/passivationinduced reflection. The difference in the spatial dependence of
collected charge between the MOSFET and diode is explained by
bipolar amplification of the charge carriers in the MOSFETs.
TCAD device simulations extend this analysis to heavy ioninduced charge collection. In addition, there is discussion
comparing this analysis with experimental results from prior
works that show enhanced charge collection resulting from
heavy ion irradiation.
Main Authors
Format
Articles
Research article
Published
2019
Series
Subjects
Publication in research information system
Publisher
Institute of Electrical and Electronics Engineers
The permanent address of the publication
https://urn.fi/URN:NBN:fi:jyu-201907173642Use this for linking
Review status
Peer reviewed
ISSN
0018-9499
DOI
https://doi.org/10.1109/TNS.2019.2922883
Language
English
Published in
IEEE Transactions on Nuclear Science
Citation
- Johnson, R. A., Witulski, A. F., Ball, D. R., Galloway, K. F., Sternberg, A. L., Zhang, E., Ryder, L. D., Reed, R. A., Schrimpf, R. D., Kozub, J. A., Lauenstein, J.-M., & Javanainen, A. (2019). Enhanced Charge Collection in SiC Power MOSFETs Demonstrated by Pulse-Laser Two-Photon Absorption SEE Experiments. IEEE Transactions on Nuclear Science, 66(7), 1694-1701. https://doi.org/10.1109/TNS.2019.2922883
Additional information about funding
10.13039/100000104-National Aeronautics and Space Administration; NASA Electronic Parts and Packaging Program
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