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dc.contributor.authorGhanbari, Hadi
dc.contributor.authorBesker, Terese
dc.contributor.authorMartini, Antonio
dc.contributor.authorBosch, Jan
dc.date.accessioned2017-11-27T09:24:42Z
dc.date.available2017-11-27T09:24:42Z
dc.date.issued2017
dc.identifier.citationGhanbari, H., Besker, T., Martini, A., & Bosch, J. (2017). Looking for Peace of Mind? Manage your (Technical) Debt : An Exploratory Field Study. In <i>ESEM 2017 : ACM/IEEE International Symposium on Empirical Software Engineering and Measurement</i> (pp. 384-393). IEEE Computer Society Press. <a href="https://doi.org/10.1109/ESEM.2017.53" target="_blank">https://doi.org/10.1109/ESEM.2017.53</a>
dc.identifier.otherCONVID_27381744
dc.identifier.otherTUTKAID_75854
dc.identifier.urihttps://jyx.jyu.fi/handle/123456789/56010
dc.description.abstractBackground: In the last two decades Technical Debt (TD) has received a considerable amount of attention from software engineering research and practice. Recently, a small group of studies suggests that, in addition to its technical and economic consequences, TD can affect developers’ psychological states and morale. However, until now there has been a lack of empirical research clarifying such influences. Aims: In this study, we aim at taking the first step in filling this gap by investigating the potential impacts of TD and its management on developers’ morale. Method: Drawing from previous literature on morale, we decided to explore the influence of TD and its management on three dimensions of morale called affective, future/goal, and interpersonal antecedents. In so doing, we conducted an exploratory field study and collected data from software professionals active in different industrial domains through eight qualitative interviews and an online survey (n=33). Results: Our results indicate that TD mainly has a negative influence on future/goal and affective antecedents of morale. This is mainly because the occurrence of TD hinders developers from performing their tasks and achieving their goals. TD management, on the other hand, has a positive influence on all the three dimensions of morale since it is associated with positive feelings and interpersonal feedback as well as a sense of progress. Conclusions: According to the results of this empirical study, the occurrence of TD reduces developers’ morale, while its management increases developers’ morale.
dc.language.isoeng
dc.publisherIEEE Computer Society Press
dc.relation.ispartofESEM 2017 : ACM/IEEE International Symposium on Empirical Software Engineering and Measurement
dc.subject.othertechnical debt
dc.subject.othermorale
dc.subject.otherbehavioral software engineering
dc.subject.otherexploratory field study
dc.subject.othermixed-method
dc.subject.otherthematic analysis
dc.subject.otherinformation systems development
dc.titleLooking for Peace of Mind? Manage your (Technical) Debt : An Exploratory Field Study
dc.typeconferenceObject
dc.identifier.urnURN:NBN:fi:jyu-201711244361
dc.contributor.laitosInformaatioteknologian tiedekuntafi
dc.contributor.laitosFaculty of Information Technologyen
dc.contributor.oppiaineTietojärjestelmätiedefi
dc.contributor.oppiaineInformation Systems Scienceen
dc.type.urihttp://purl.org/eprint/type/ConferencePaper
dc.date.updated2017-11-24T10:15:08Z
dc.relation.isbn978-1-5090-4039-1
dc.type.coarhttp://purl.org/coar/resource_type/c_5794
dc.description.reviewstatuspeerReviewed
dc.format.pagerange384-393
dc.relation.issn1949-3789
dc.type.versionacceptedVersion
dc.rights.copyright© 2017 IEEE. Personal use of this material is permitted. Permission from IEEE must be obtained for all other uses, in any current or future media, including reprinting/republishing this material for advertising or promotional purposes, creating new collective works, for resale or redistribution to servers or lists, or reuse of any copyrighted component of this work in other works.
dc.rights.accesslevelopenAccessfi
dc.relation.conferenceInternational Symposium on Empirical Software Engineering and Measurement
dc.subject.ysoohjelmistokehitys
jyx.subject.urihttp://www.yso.fi/onto/yso/p21530
dc.relation.doi10.1109/ESEM.2017.53
dc.type.okmA4


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